Transient thermal analysis as measurement method for IC package structural integrity
Hanß Alexander, Schmid Maximilian, Liu E, Elger Gordon†
Transient thermal analysis as measurement method for IC package structural integrity |
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Hanß Alexander, Schmid Maximilian, Liu E, Elger Gordon†
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| Reproducibility of the thermal interface material between module and heat sink. Thermal grease was applied between heat sink and LED module (LUXEON Altilon test package, 1-A drive current at 12 V). The module was taken off and mounted by springs (same mounting force) on the heat sink several times and measured. A significant deviation of 0.1 W/K is visible. |
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