An analytical model of thermal mechanical stress induced by through silicon via
Dong Gang†
, Shi Tao, Zhao Ying-Bo, Yang Yin-Tang
, Shi Tao, Zhao Ying-Bo, Yang Yin-Tang 
An analytical model of thermal mechanical stress induced by through silicon via |
|
Dong Gang†
, Shi Tao, Zhao Ying-Bo, Yang Yin-Tang |
| Comparison between analytical model and FEA simulation of a single TSV. (a) Hoop stress; (b) radial stress. |
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