An analytical model of thermal mechanical stress induced by through silicon via
Dong Gang†
, Shi Tao, Zhao Ying-Bo, Yang Yin-Tang
, Shi Tao, Zhao Ying-Bo, Yang Yin-Tang 
An analytical model of thermal mechanical stress induced by through silicon via |
|
Dong Gang†
, Shi Tao, Zhao Ying-Bo, Yang Yin-Tang |
| TSV baseline structure. |
| |