Analysis of functional failure mode of commercial deep sub-micron SRAM induced by total dose irradiation

Zheng Qi-Wen^a),^b),^c), Cui Jiang-Wei†^a),^b), Zhou Hang^a),^b),^c), Yu De-Zhao^a),^b),^c), Yu Xue-Feng^a),^b), Lu Wu^a),^b), Guo Qi^a),^b), Ren Di-Yuan^a),^b)

Standby and dynamic current of device loading data pattern AAh during irradiation after 128-h anneal at room temperature, and testing is accomplished after data patterns 55h and AAh have been written into the device.