Design and characterization of a 3D encapsulation with silicon vias for radio frequency micro-electromechanical system resonator
赵继聪, 袁泉, 王凤祥, 阚骁, 韩国威, 孙玲, 孙海燕, 杨晋玲, 杨富华
Design and characterization of a 3D encapsulation with silicon vias for radio frequency micro-electromechanical system resonator
Ji-Cong Zhao(赵继聪), Quan Yuan(袁泉), Feng-Xiang Wang(王凤祥), Xiao Kan(阚骁), Guo-Wei Han(韩国威), Ling Sun(孙玲), Hai-Yan Sun(孙海燕), Jin-Ling Yang(杨晋玲), Fu-Hua Yang(杨富华)
中国物理B
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2017, (6): 60705
-060705
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DOI: 10.1088/1674-1056/26/6/060705