An analytical model of thermal mechanical stress induced by through silicon via
董刚, 石涛, 赵颖博, 杨银堂
An analytical model of thermal mechanical stress induced by through silicon via
Dong Gang (董刚), Shi Tao (石涛), Zhao Ying-Bo (赵颖博), Yang Yin-Tang (杨银堂)
中国物理B . 2015, (5): 56601 -056601 .  DOI: 10.1088/1674-1056/24/5/056601