Through-silicon-via crosstalk model and optimization design for three-dimensional integrated circuits

钱利波, 朱樟明, 夏银水, 丁瑞雪, 杨银堂

Qian Li-Bo (钱利波), Zhu Zhang-Ming (朱樟明), Xia Yin-Shui (夏银水), Ding Rui-Xue (丁瑞雪), Yang Yin-Tang (杨银堂)

中国物理B . 2014, (3): 38402 -038402 . DOI: 10.1088/1674-1056/23/3/038402