中国物理B ›› 2026, Vol. 35 ›› Issue (7): 70701-070701.doi: 10.1088/1674-1056/ae3309

• • 上一篇    

Electrocaloric thermal management devices: Toward high-efficiency solid-state refrigeration

Yiwen Bo(薄轶文) and Rujun Ma(马儒军)†   

  1. School of Materials Science and Engineering, Nankai University, Tianjin 300350, China
  • 收稿日期:2025-11-22 修回日期:2025-12-27 接受日期:2026-01-04 发布日期:2026-07-02
  • 通讯作者: Rujun Ma E-mail:malab@nankai.edu.cn
  • 基金资助:
    We acknowledge the support by the fellowship of China National Postdoctoral Program for Innovative Talents (Grant No. BX20250287), the National Natural Science Fundation of China (Grant Nos. 523B2108, 52273248, and 52473215), the National Key R&D Program of China (Grant No. 2020YFA0711500), the Municipal Natural Science Foundation of Tianjin (Grant No. 24JCJQJC00230), Scientific Research Innovation Capability Support Project for Young Faculty, and China Postdoctoral Science Foundation (Grant No. 2023M731783).

Electrocaloric thermal management devices: Toward high-efficiency solid-state refrigeration

Yiwen Bo(薄轶文) and Rujun Ma(马儒军)†   

  1. School of Materials Science and Engineering, Nankai University, Tianjin 300350, China
  • Received:2025-11-22 Revised:2025-12-27 Accepted:2026-01-04 Published:2026-07-02
  • Contact: Rujun Ma E-mail:malab@nankai.edu.cn
  • Supported by:
    We acknowledge the support by the fellowship of China National Postdoctoral Program for Innovative Talents (Grant No. BX20250287), the National Natural Science Fundation of China (Grant Nos. 523B2108, 52273248, and 52473215), the National Key R&D Program of China (Grant No. 2020YFA0711500), the Municipal Natural Science Foundation of Tianjin (Grant No. 24JCJQJC00230), Scientific Research Innovation Capability Support Project for Young Faculty, and China Postdoctoral Science Foundation (Grant No. 2023M731783).

PDF (PC)

5

赞

摘要： Addressing the urgent demands for intelligent, miniaturized, and efficient thermal management in modern electronics, alongside the energy and environmental constraints, the development of compact and high-performance cooling systems has become imperative. The electrocaloric (EC) effect, which enables reversible entropy and temperature changes in dielectric materials through electric-field-controlled polarization, offers distinct advantages including high efficiency, fast response, and ease of integration. This review outlines the thermodynamic principles and surveys the evolution of EC thermal management devices. Ceramic-based EC devices exhibit strong potential for high-power applications due to their high thermal conductivity and thermal stability, while polymer-based EC devices are suited for wearable and flexible integration because of their mechanical compliance and processability. This review further contrasts the design, actuation, and application profiles of these platforms. Despite notable progress, challenges remain in long-term stability, multi-physics coupling, miniaturized integration, and environmental adaptability. Advances in material understanding, device design, and intelligent system control will position EC technology as a key enabler of efficient, compact, and sustainable next-generation thermal management.

关键词: electrocaloric effect, thermal management device, coefficient of performance, high-power and wearable refrigeration

Abstract: Addressing the urgent demands for intelligent, miniaturized, and efficient thermal management in modern electronics, alongside the energy and environmental constraints, the development of compact and high-performance cooling systems has become imperative. The electrocaloric (EC) effect, which enables reversible entropy and temperature changes in dielectric materials through electric-field-controlled polarization, offers distinct advantages including high efficiency, fast response, and ease of integration. This review outlines the thermodynamic principles and surveys the evolution of EC thermal management devices. Ceramic-based EC devices exhibit strong potential for high-power applications due to their high thermal conductivity and thermal stability, while polymer-based EC devices are suited for wearable and flexible integration because of their mechanical compliance and processability. This review further contrasts the design, actuation, and application profiles of these platforms. Despite notable progress, challenges remain in long-term stability, multi-physics coupling, miniaturized integration, and environmental adaptability. Advances in material understanding, device design, and intelligent system control will position EC technology as a key enabler of efficient, compact, and sustainable next-generation thermal management.

Key words: electrocaloric effect, thermal management device, coefficient of performance, high-power and wearable refrigeration

中图分类号:  (Thermal instruments and apparatus)

  • 07.20.-n
85.50.-n (Dielectric, ferroelectric, and piezoelectric devices) 77.84.-s (Dielectric, piezoelectric, ferroelectric, and antiferroelectric materials) 77.90.+k (Other topics in dielectrics, piezoelectrics, and ferroelectrics and their properties)