中国物理B ›› 2014, Vol. 23 ›› Issue (4): 44601-044601.doi: 10.1088/1674-1056/23/4/044601

• ELECTROMAGNETISM, OPTICS, ACOUSTICS, HEAT TRANSFER, CLASSICAL MECHANICS, AND FLUID DYNAMICS • 上一篇    下一篇

Fatigue damage behavior of a surface-mount electronic package under different cyclic applied loads

任淮辉a b, 王习术b   

  1. a Longyuan (Beijing) Wind Power Engineer Technology Co. Ltd, Beijing 100034, China;
    b Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China
  • 收稿日期:2013-06-04 修回日期:2013-08-25 出版日期:2014-04-15 发布日期:2014-04-15
  • 基金资助:
    Project supported by the National Basic Research Program of China (Grant No. 2010CB631006) and the National Natural Science Foundation of China (Grant Nos. 11072124 and 11272173).

Fatigue damage behavior of a surface-mount electronic package under different cyclic applied loads

Ren Huai-Hui (任淮辉)a b, Wang Xi-Shu (王习术)b   

  1. a Longyuan (Beijing) Wind Power Engineer Technology Co. Ltd, Beijing 100034, China;
    b Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China
  • Received:2013-06-04 Revised:2013-08-25 Online:2014-04-15 Published:2014-04-15
  • Contact: Ren Huai-Hui E-mail:renhuaihui@foxmail.com
  • About author:46.50.+a; 74.25.Jb; 62.20.M-
  • Supported by:
    Project supported by the National Basic Research Program of China (Grant No. 2010CB631006) and the National Natural Science Foundation of China (Grant Nos. 11072124 and 11272173).

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摘要： This paper studies and compares the effects of pull-pull and 3-point bending cyclic loadings on the mechanical fatigue damage behaviors of a solder joint in a surface-mount electronic package. The comparisons are based on experimental investigations using scanning electron microscopy (SEM) in-situ technology and nonlinear finite element modeling, respectively. The compared results indicate that there are different threshold levels of plastic strain for the initial damage of solder joints under two cyclic applied loads; meanwhile, fatigue crack initiation occurs at different locations, and the accumulation of equivalent plastic strain determines the trend and direction of fatigue crack propagation. In addition, simulation results of the fatigue damage process of solder joints considering a constitutive model of damage initiation criteria for ductile materials and damage evolution based on accumulating inelastic hysteresis energy are identical to the experimental results. The actual fatigue life of the solder joint is almost the same and demonstrates that the FE modeling used in this study can provide an accurate prediction of solder joint fatigue failure.

关键词: solder joint, fatigue life, hysteresis energy, SEM in-situ technology

Abstract: This paper studies and compares the effects of pull-pull and 3-point bending cyclic loadings on the mechanical fatigue damage behaviors of a solder joint in a surface-mount electronic package. The comparisons are based on experimental investigations using scanning electron microscopy (SEM) in-situ technology and nonlinear finite element modeling, respectively. The compared results indicate that there are different threshold levels of plastic strain for the initial damage of solder joints under two cyclic applied loads; meanwhile, fatigue crack initiation occurs at different locations, and the accumulation of equivalent plastic strain determines the trend and direction of fatigue crack propagation. In addition, simulation results of the fatigue damage process of solder joints considering a constitutive model of damage initiation criteria for ductile materials and damage evolution based on accumulating inelastic hysteresis energy are identical to the experimental results. The actual fatigue life of the solder joint is almost the same and demonstrates that the FE modeling used in this study can provide an accurate prediction of solder joint fatigue failure.

Key words: solder joint, fatigue life, hysteresis energy, SEM in-situ technology

中图分类号:  (Fracture mechanics, fatigue and cracks)

  • 46.50.+a
74.25.Jb (Electronic structure (photoemission, etc.)) 62.20.M- (Structural failure of materials)