Experimental and theoretical analysis of package-on-package structure under three-point bending loading

doi:10.1088/1674-1056/21/12/126201

Chin. Phys. B ›› 2012, Vol. 21 ›› Issue (12): 126201-126201.doi: 10.1088/1674-1056/21/12/126201

• CONDENSED MATTER: STRUCTURAL, MECHANICAL, AND THERMAL PROPERTIES • 上一篇下一篇

Experimental and theoretical analysis of package-on-package structure under three-point bending loading

贾苏^a, 王习术^a, 任淮辉^{a b}

a Department of Engineering Mechanics, AML, Tsinghua University, Beijing 100084, China;
b China Longyuan Power Group Corporation Limited, China Goudian, Beijing 100034, China

收稿日期:2012-05-10 修回日期:2012-07-23 出版日期:2012-11-01 发布日期:2012-11-01
基金资助:
Projects supported by the National Natural Science Foundation of China (Grant Nos. 11072124 and 11272173), the National Basic Research Program of China (Grant No. 2010CB631006), and the State Key Laboratory of Advanced Metals and Materials, China (Grant No. 2010ZD-04).

Experimental and theoretical analysis of package-on-package structure under three-point bending loading

Jia Su (贾苏)^a, Wang Xi-Shu (王习术)^a, Ren Huai-Hui (任淮辉)^{a b}

a Department of Engineering Mechanics, AML, Tsinghua University, Beijing 100084, China;
b China Longyuan Power Group Corporation Limited, China Goudian, Beijing 100034, China

Received:2012-05-10 Revised:2012-07-23 Online:2012-11-01 Published:2012-11-01
Contact: Wang Xi-Shu E-mail:xshwang@tsinghua.edu.cn
Supported by:
Projects supported by the National Natural Science Foundation of China (Grant Nos. 11072124 and 11272173), the National Basic Research Program of China (Grant No. 2010CB631006), and the State Key Laboratory of Advanced Metals and Materials, China (Grant No. 2010ZD-04).

摘要/Abstract

摘要： High density package is developing toward miniaturization and integration, which causes many difficulties in designing, manufacturing, and reliability testing. Package-on-Package (PoP) is a promising three-dimensional high-density packaging method that integrates chip scale package (CSP) in the top package and fine-pitch ball grid array (FBGA) in the bottom package. In this paper, in-situ scanning electron microscopy (SEM) observation is carried out to detect the deformation and damage of the PoP structure under three-point bending loading. The results indicate that the cracks occur in the die of the top package, then cause the crack deflection and bridging in the die attaching layer. Furthermore, the mechanical principles are used to analyse the cracking process of the PoP structure based on the multi-layer laminating hypothesis. And the theoretical analysis results are found to be in good agreement with the experimental results.

关键词: high density package, in-situ SEM observation, three-point bending, multi-layer laminating hypothesis

Abstract: High density package is developing toward miniaturization and integration, which causes many difficulties in designing, manufacturing, and reliability testing. Package-on-Package (PoP) is a promising three-dimensional high-density packaging method that integrates chip scale package (CSP) in the top package and fine-pitch ball grid array (FBGA) in the bottom package. In this paper, in-situ scanning electron microscopy (SEM) observation is carried out to detect the deformation and damage of the PoP structure under three-point bending loading. The results indicate that the cracks occur in the die of the top package, then cause the crack deflection and bridging in the die attaching layer. Furthermore, the mechanical principles are used to analyse the cracking process of the PoP structure based on the multi-layer laminating hypothesis. And the theoretical analysis results are found to be in good agreement with the experimental results.

Key words: high density package, in-situ SEM observation, three-point bending, multi-layer laminating hypothesis

中图分类号: (Structural failure of materials)

62.20.M-

85.85.+j (Micro- and nano-electromechanical systems (MEMS/NEMS) and devices) 46.50.+a (Fracture mechanics, fatigue and cracks) 46.70.-p (Application of continuum mechanics to structures)

贾苏, 王习术, 任淮辉. Experimental and theoretical analysis of package-on-package structure under three-point bending loading[J]. Chin. Phys. B, 2012, 21(12): 126201-126201.

Jia Su (贾苏), Wang Xi-Shu (王习术), Ren Huai-Hui (任淮辉). Experimental and theoretical analysis of package-on-package structure under three-point bending loading[J]. Chin. Phys. B, 2012, 21(12): 126201-126201.

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Experimental and theoretical analysis of package-on-package structure under three-point bending loading

Experimental and theoretical analysis of package-on-package structure under three-point bending loading

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