中国物理B ›› 1996, Vol. 5 ›› Issue (4): 306-311.doi: 10.1088/1004-423X/5/4/008

• • 上一篇    

SOLUTE REDISTRIBUTION IN THE INITIAL TRANSIENT REGION OF DIRECTIONAL SOLIDIFICATION SPECIMEN

马东, 介万奇   

  1. State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi'an 710072, China
  • 收稿日期:1995-04-03 出版日期:1996-04-20 发布日期:1996-04-20
  • 基金资助:
    Project supported by the National Natural Science Foundation of China.

SOLUTE REDISTRIBUTION IN THE INITIAL TRANSIENT REGION OF DIRECTIONAL SOLIDIFICATION SPECIMEN

MA DONG (马东), JIE WAN-QI (介万奇)   

  1. State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi'an 710072, China
  • Received:1995-04-03 Online:1996-04-20 Published:1996-04-20
  • Supported by:
    Project supported by the National Natural Science Foundation of China.

摘要: The solute redistribution during initial transient process of directional solidification of a binary alloy is associated with the solid-liquid interface advancing velocity which will pass a hysteretic process approaching to the externally imposed velocity. In the present paper, a new accelerated growth equation, dV/dt = μG[m/G·(dGL*)/dt+Ve-V] is deduced, based on which a new formula for the initial transient solute redistribution is obtained with the reasonable assumption that the solid-liquid interface advancing velocity changes exponentially during solidification. It shows that the kinematic effect dominates solidification at high velocity while the coupling effect of thermal and mass transportation controls that at lower velocity.In addition, another new equation to calculate the time required for a planar interface to lose stability is also found. Since the effects of the imposed thermal gradient are taken into account in the new equations, they are more reasonable and satisfactory than those given by Tiller et al. and by Smith et al.

Abstract: The solute redistribution during initial transient process of directional solidification of a binary alloy is associated with the solid-liquid interface advancing velocity which will pass a hysteretic process approaching to the externally imposed velocity. In the present paper, a new accelerated growth equation, dV/dt = μG[$\frac{m}{G}$·$\frac{{\rm d}G^*_{\rm L}}{{\rm d}t}$+Ve-V] is deduced, based on which a new formula for the initial transient solute redistribution is obtained with the reasonable assumption that the solid-liquid interface advancing velocity changes exponentially during solidification. It shows that the kinematic effect dominates solidification at high velocity while the coupling effect of thermal and mass transportation controls that at lower velocity.In addition, another new equation to calculate the time required for a planar interface to lose stability is also found. Since the effects of the imposed thermal gradient are taken into account in the new equations, they are more reasonable and satisfactory than those given by Tiller et al.[1] and by Smith et al.[2]

中图分类号:  (Solid-liquid transitions)

  • 64.70.D-
81.30.Fb (Solidification) 81.10.Fq (Growth from melts; zone melting and refining) 65.40.G- (Other thermodynamical quantities)