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Two kinds of films were prepared to study the effect of microstructure on helium migration in Ti tritides. Both films showed different release behaviors and helium bubble distributions. In the film consisting of columnar grains, a two-layered structure was observed. Inclusions with a strip feature were found at the grain boundary, and no helium bubbles were distributed in these inclusions. However, helium preferred to migrate to the boundaries of these inclusions. Bubble linkage as a ribbon-like feature developed parallel to the film surface in the film consisting of columnar grains. More cracks were developed at the grain boundaries of the film consisting of columnar grains, although the helium content in the film consisting of columnar grains was less than that in the film consisting of equiaxed grains. A surface region with a small number of bubbles, or “depleted zone”, was observed near the surface. The cracks extending to the film surface were the pathways of the critical helium released from the film. The helium migration was strongly influenced by the grain microstructure.
Tritium has many important technological applications. It is common to combine tritium with a metal to form metal tritides for stable, high-density storage of tritium. 3He is produced by the radioactive decay of tritium. It is well known that at least initially, most of the 3He remains in the solid, and only less than 1% of the generated 3He is released from metal tritides.[1,2] Snow et al. showed that the total amount of helium released early in life was independent of the film thickness, which suggested that the helium released early in life came from the near-surface region.[3] When the helium concentration in metal tritides reached a critical value, helium was released at rates equal to or sometimes exceeding the generation rate. The onset of critical release was found to vary for different metals, and it occurred around 0.3 (He:metal ratio) for erbium tritides and titanium tritides, and around 0.40 for zirconium tritides.[2] Helium accumulation in metal tritides would cause considerable changes in the structure and properties of these materials, such as volume expansion and the decrease of the plateau pressure.
The recoil energy of 3He created by tritium decay was estimated to be ∼ 1.03 eV, which was too low to make it leave the tetrahedral site in which it was created.[4] It was found that helium atoms could become weakly bound to either lattice defects or other helium atoms they encountered as they migrated.[5,6] It has also been proved that the interstitial helium can strongly bind to the grain boundary.[7] Helium bubbles in aging metal tritides were commonly seen in the lattice and grain boundary by the transmission electronic microscopy (TEM).[8–12] Helium bubble evolution in metal tritides is a complicated process, the study of which requires modeling at many different levels including atomic properties of 3He atoms in metal lattices, diffusion mechanisms, kinetics of bubble nucleation and growth, and the relationship between the microstructural evolution and the change in mechanical properties.[13,14]
The microstructure of the film was believed to have a strong effect on the helium migration and has been studied extensively.[3,15–18] The structure of films could involve a number of characteristics, such as grain size, strain, crystallographic orientation, and so on. It was shown that the film structure was strongly affected by the preparation procedures and deposition condition, such as substrate temperature,[19,20] deposition rate,[21] substrate materials,[22] impurity contamination, and film thickness.[23–25]
The purpose of this paper is to study 3He migration in TiT1.9 films. We prepared two kinds of Ti tritide films with different grain morphologies, and presented the results of the helium release measurement and TEM analysis of these two kinds of Ti tritide films during aging. The decisive factors in microstructure and the roles of these factors on the helium bubble distribution and helium release were clarified.
In this study, two kinds of titanium films were prepared to several micrometers by physical evaporation on rolled molybdenum substrates. The film of sample C was deposited at a rate of 25 nm/s by electron-beam evaporation, and the film of sample E was deposited at a rate of 100 nm/s by resistance heating. The substrate temperature was 500 °C, and the pressure of the vacuum system was 2 × 10−4 Pa for all the samples during evaporation. The thicknesses of these films were almost the same by controlling the deposition time.
These films were transported to a tritiding facility and loaded with tritium to produce tritide films with the initial composition of TiT1.9. The amount of the absorbed tritium in films was estimated by deducting the exact residual pressure from the initial loading tritium pressure in the container. The samples were stored in a vacuum vessel at room temperature, and the amount of helium released during the storage was measured by a quadrupole mass spectrometer (QMS). The 3He concentration in the aging samples was obtained from both the initial tritium content and the aging time, which was revised by the releasing amount of helium from the film surface.
The cross-sectional TEM samples were obtained using a focused-ion beam instrument (FIB). From the titanium tritide films, 20 μm × 10μ m sections were cut and mounted on FIB half grid. The samples were then thinned to ∼ 100 nm by FIB. During these processes, helium may be released from the surface layer, and the surface layers may be amorphized by ion milling. In addition to inclining the incident ion beam to the surface of the specimen and lowering the beam energy to minimize these effects, more thick films were preserved to retain the physical environment for helium only when it did not influence the observation in the TEM. The prepared samples were transferred from FIB to TEM in several minutes. TEM analysis was performed using an FEI F30 300 kV TEM.
A large number of measurements have been made on helium emission from these two kinds of Ti tritide films in the past.[2] Figure
The crystal structures of these two kinds of films were studied by x-ray diffraction (XRD), and the results are shown in Fig.
Figures
The grain in sample E is a typical equiaxed three-dimensional structure. The film of sample E was deposited at a high deposition rate by resistive heating, and the grains grew faster, thereby favoring grain coarsening and restructuration, as well as less oxygen contamination.
Figure
More cracks are found in sample C, and these cracks become wider as they approach the film surface, as shown in Fig.
The helium content of sample C is lower than that of sample E, but more cracks developed in sample C, which implies that there are more helium atoms migrating from the interior grain to the grain boundary in sample C than in sample E.
Figure
Figure
Figure
As the helium content in the film increases, the stress increases, which would result in a large difference in stress between the inner films and the surface. These loops are likely to be produced by the high internal stress. The number and the size of these loops in sample E are higher than those in sample C. The increase of the stress with helium content in the samples would generate more dislocations in the surface layer and drive the growth of these dislocations.
The film structure of sample C is a multi-layered columnar grain. In the model of Barna et al., the formation of polycrystalline films is considered as the growth of many single crystallites through the growth of characteristic layers, which occurs on their individual crystallographic faces.[33] The presence of foreign atoms or molecules directly influences these processes. The adsorbed oxygen continuously accumulates at growth steps. Consequently, two-dimensional oxide films are formed, obstructing layer growth.[21] This can be confirmed by the strip inclusion distributed on the boundaries of two-layered columnar grains, as shown in Fig.
Inclusions are generally observed in all Ti tritide samples. Some of them are distributed inside grains, but most of them are distributed at grain boundaries. The inclusions in Ti tritides appear as long strips, which are different from the particle-shaped oxides in Er(D,T)2 − x 3Hex.[3] The energy-dispersive x-ray spectroscopy (EDS) analyses of these inclusions did not show the signal of oxygen. Parish et al. studied the oxygen contamination in ErD2 thin films and indicated that due to oxygen’s low x-ray and the easy absorption of soft oxygen x-rays, EDS was not expected to yield high signal-to-noise ratios for oxygen.[16] However, energy-filtered TEM showed thick near-surface oxides and intrafilm oxide particles in the D-loaded ErD2 films.[16] Thus the strip feature in Ti tritide films is probably flaky and has a low oxygen distribution.
Snow et al. studied helium release in Er(D,T)2 − x 3Hex films and showed that the amount of helium released as a function of film thickness was relatively constant, suggesting that helium was being released only from the near-surface region and did not diffuse into the surface from the interior of the film.[3] The surface of Ti tritide films forms a thicker depleted zone than Er tritides, but the early release fraction for Ti tritides is lower by more than one order of magnitude.[2] There are more bubbles observed in the depleted zone of the Ti tritide films. Accordingly, the difference of helium diffusion rate in the depleted zone of the Ti and Er tritide films is obvious. The slow helium diffusion rate in the depleted zone of the Ti tritide films could be responsible for the observation of more helium bubbles and the low early release fraction from the film surface.
Compared with sample E, sample C shows strong helium bubble linkage and orientation distribution in the grains. The bubble coalescence in the grains is probably the result of the stress distribution in the film. Rodriguez et al. made a detailed XRD analysis of the ErT2 film, which revealed significant in-plane compressive macro-strain due to 3He bubble formation/growth.[34] The different size and number of dislocation loops ejected on these two kinds of film surfaces could be understood by the different stress distributions in these two films. It seems that a higher stress is distributed in sample E and relatively low stress is distributed in sample C.
Before the bubble interconnection, it is common to observe helium bubbles distributed along {111} planes, as shown in Fig.
At He/Ti = 0.27, the He release rate for sample E begins to increase rapidly from a constant value, much later than sample C in Fig.
The helium migration is greatly affected by the grain structure of the film. The migration and accumulation of helium at the grain boundary would be accelerated in the film consisting of columnar grains due to its small flaky grain structure and grain orientation distribution, compared with the film consisting of equiaxed grain structure. Columnar grains are weakly bonded and easily separated by the accumulation of helium on the grain boundaries. Cracks develop along the grain boundary in both films, most of which are nearly parallel to the film surface and widen near the surface. Bubble linkage as a ribbonlike feature develops parallel to the film surface in the film consisting of columnar grains. Inclusions as a strip feature are found in both kinds of films, at the boundary of which a high concentration of helium is observed. The critical 3He release from the surface comes from the cracks developed at grain boundaries extending to the film surface.
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