Detection and formation mechanism of micro-defects in ultrafine pitch Cu

Detection and formation mechanism of micro-defects in ultrafine pitch Cu—Cu direct bonding

Liu Zi-Yu¹, Cai Jian^{1, 2, †,}, Wang Qian¹, Chen Yu¹

Interface morphologies of the cross section (a) after annealing and quick cooling and (b) 182 hours later.