Fin width and height dependence of bipolar amplification in bulk FinFETs submitted to heavy ion irradiation*
Yu Jun-Tinga), Chen Shu-Minga),b), Chen Jian-Juna), Huang Peng-Chenga)
       
(a) 3D TCAD structure of the bulk p -FinFET. (b), (c) Top and cross-section views of FinFET, showing the gate length, fin width, and height of the device schematically, which are cut along the X – Y and Y – Z planes, respectively. The inset shows a zoomed view of the p -FinFET structure.