Design and characterization of a 3D encapsulation with silicon vias for radio frequency micro-electromechanical system resonator

doi:10.1088/1674-1056/26/6/060705

Abstract In this paper, we present a three-dimensional (3D) vacuum packaging technique at a wafer level for a radio frequency micro-electromechanical system (RF MEMS) resonator, in which low-loss silicon vias is used to transmit RF signals. Au-Sn solder bonding is adopted to provide a vacuum encapsulation as well as electrical conductions. A RF model of the encapsulation cap is established to evaluate the parasitic effect of the packaging, which provides an effective design solution of 3D RF MEMS encapsulation. With the proposed packaging structure, the signal-to-background ratio (SBR) of 24 dB is achieved, as well as the quality factor (Q-factor) of the resonator increases from 8000 to 10400 after packaging. The packaged resonator has a linear frequency-temperature (f-T) characteristic in a temperature range between 0℃ and 100℃. And the package shows favorable long-term stability of the Q-factor over 200 days, which indicates that the package has excellent hermeticity. Furthermore, the average shear strength is measured to be 43.58 MPa among 10 samples.

Keywords: 3D packaging coupling noise Q-factor RF MEMS resonator

Received: 06 January 2017
Revised: 06 March 2017
Accepted manuscript online:

PACS:	07.10.Cm	(Micromechanical devices and systems)
	85.85.+j	(Micro- and nano-electromechanical systems (MEMS/NEMS) and devices)
	07.50.Hp	(Electrical noise and shielding equipment)

Fund: Project supported by the National Natural Science Foundation of China (Grant Nos. 61234007, 61404136, and 61504130), the Fund from the Ministry of Science and Technology of China (Grant No. 2013YQ16055103), the Key Research & Development Program of Jiangsu Province, China (Grant No. BE2016007-2), and the Major Project of Natural Science Research of the Higher Education Institutions of Jiangsu Province, China (Grant No. 16KJA510006).

Corresponding Authors: Jin-Ling Yang
E-mail: jlyang@semi.ac.cn

Cite this article:

Ji-Cong Zhao(赵继聪), Quan Yuan(袁泉), Feng-Xiang Wang(王凤祥), Xiao Kan(阚骁), Guo-Wei Han(韩国威), Ling Sun(孙玲), Hai-Yan Sun(孙海燕), Jin-Ling Yang(杨晋玲), Fu-Hua Yang(杨富华) Design and characterization of a 3D encapsulation with silicon vias for radio frequency micro-electromechanical system resonator 2017 Chin. Phys. B 26 060705

[1]	Vig J and Ballato A 1999 Chapter 7: Frequency Control Devices (Academic Press Inc.) pp. 637-701
[2]	Wang Z Y 2012 J. Microelectromech. Syst. 24 1211
[3]	Zoschke K, Manier C A, Wilke M, Oppermann H, Ruffieux D, Dekker J, Jaakkola A, Piazza S D, Allegato G and Lang K D 2015 Proceedings of the 65th Electronic Components and Technology Conference, May 26-29, San Diego, USA, p. 1343
[4]	Li H Y, Xie L, Ong L G, Baram A, Herer I, Hirshberg A, Chong S C, Gao S and Kwonget D L 2012 IEEE Electron Dev. Lett. 33 432
[5]	Lim Y Y, Chen B T, Yu A B and Shi J L 2011 Proceedings of the 16th Transducers Conference, June 5-9, Beijing, China, p. 406
[6]	Jin J Y, Yoo S, Yoo B W and Kim Y K 2012 Electron. Lett. 48 1354
[7]	Haque R M, Serrano D E, Gao X, Shirazi A N, Keesara V, Ayazi F and Wise K D 2011 Proceedings of the 16th Transducers Conference, June 5-9, Beijing, China, p. 2303
[8]	Haque R M and Wise K D 2013 J. Microelectromech. Syst. 22 1470
[9]	Candler R N, Hopcroft M A, Kim B, Park W T, Melamud R, Agarwal M, Yama G, Partridge A, Lutz M and Kenny T W 2006 J. Microelectromech. Syst. 15 1446
[10]	Kim B, Candler R N, Hopcroft M A, Agarwal M, Park W T and Kenny T W 2007 Sens. Actuators A 136 125
[11]	Mao X, Lv X D, Wei W W, Zhang Z, Yang J L, Qi Z M and Yang F H 2014 Chin. Phys. Lett. 31 05683
[12]	Peng B H, Luo W, Zhao J C, Yuan Q, Yang J L and Yang F H 2015 J. Semicond. 36 074010
[13]	Fang Z Q, Mao X, Yang J L and Yang F H 2013 J. Semicond. 34 106001
[14]	Zhao H, Luo W, Zheng H Y, Yang J L and Yang F H 2012 Chin. Phys. B 21 100702

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Design and characterization of a 3D encapsulation with silicon vias for radio frequency micro-electromechanical system resonator

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