Chin. Phys. B
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Chin. Phys. B  2015, Vol. 24 Issue (6): 068105    DOI: 10.1088/1674-1056/24/6/068105
TOPICAL REVIEW --- III-nitride optoelectronic materials and devices Current Issue| Next Issue| Archive| Adv Search |
Transient thermal analysis as measurement method for IC package structural integrity
Alexander Hanß, Maximilian Schmid, E Liu, Gordon Elger
Technische Hochschule Ingolstadt, Esplanade 10, 85049 Ingolstadt, Germany

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