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Chin. Phys. B, 2015, Vol. 24(2): 026802    DOI: 10.1088/1674-1056/24/2/026802
CONDENSED MATTER: STRUCTURAL, MECHANICAL, AND THERMAL PROPERTIES Prev   Next  

Effect of the thickness of InGaN interlayer on a-plane GaN epilayer

Wang Jian-Xia (王建霞)a b, Wang Lian-Shan (汪连山)a, Zhang Qian (张谦)b, Meng Xiang-Yue (孟祥岳)b, Yang Shao-Yan (杨少延)a, Zhao Gui-Juan (赵桂娟)a, Li Hui-Jie (李辉杰)a, Wei Hong-Yuan (魏鸿源)a, Wang Zhan-Guo (王占国)a
a Key Laboratory of Semiconductor Materials Science, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China;
b Patent Examination Cooperation Center of the Patent Office, SIPO, Henan, Zhengzhou 450000, China
Abstract  In this paper, we use the a-plane InGaN interlayer to improve the property of a-plane GaN. Based on the a-InGaN interlayer, a template exhibits that a regular, porous structure, which acts as a compliant effect, can be obtained to release the strain caused by the lattice and thermal mismatch between a-GaN and r-sapphire. We find that the thickness of InGaN has a great influence on the growth of a-GaN. The surface morphology and crystalline quality both are first improved and then deteriorated with increasing the thickness of the InGaN interlayer. When the InGaN thickness exceeds a critical point, the a-GaN epilayer peels off in the process of cooling down to room temperature. This is an attractive way of lifting off a-GaN films from the sapphire substrate.
Keywords:  non-polar a-plane GaN      InGaN interlayer      peel-off      metalorganic chemical vapor deposition  
Received:  20 June 2014      Revised:  09 September 2014      Accepted manuscript online: 
PACS:  68.37.Ps (Atomic force microscopy (AFM))  
  68.55.A- (Nucleation and growth)  
  78.55.Cr (III-V semiconductors)  
  81.15.Gh (Chemical vapor deposition (including plasma-enhanced CVD, MOCVD, ALD, etc.))  
Fund: Project supported by the National Natural Science Foundation of China (Grant Nos. 91233111, 61274041, and 11275228), the Special Funds for Major State Basic Research Project of China (Grant No. 2012CB619305), the National High Technology R & D Program of China (Grant Nos. 2014AA032603 and 2014AA032609), and the Guangdong Provincial Special Fund for LED Industrial Development, China (Grant No. 2012A080302003).
Corresponding Authors:  Wang Jian-Xia, Wang Lian-Shan     E-mail:  jxwang2009@semi.ac.cn;ls-wang@semi.ac.cn

Cite this article: 

Wang Jian-Xia (王建霞), Wang Lian-Shan (汪连山), Zhang Qian (张谦), Meng Xiang-Yue (孟祥岳), Yang Shao-Yan (杨少延), Zhao Gui-Juan (赵桂娟), Li Hui-Jie (李辉杰), Wei Hong-Yuan (魏鸿源), Wang Zhan-Guo (王占国) Effect of the thickness of InGaN interlayer on a-plane GaN epilayer 2015 Chin. Phys. B 24 026802

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