Chin. Phys. B
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Chin. Phys. B  2014, Vol. 23 Issue (6): 066102    DOI: 10.1088/1674-1056/23/6/066102
CONDENSED MATTER: STRUCTURAL, MECHANICAL, AND THERMAL PROPERTIES Current Issue| Next Issue| Archive| Adv Search |
Electrohydrodynamic direct-writing of conductor-insulator-conductor multi-layer interconnection
Zheng Gao-Fenga, Pei Yan-Boa b, Wang Xianga, Zheng Jian-Yia, Sun Dao-Henga
a Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen 361005, China;
b School of Mechanical and Electrical Engineering, Harbin Institute of Technology, Harbin 150001, China

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