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Experimental and theoretical analysis of package-on-package structure under three-point bending loading |
| Jia Su (贾苏)a, Wang Xi-Shu (王习术)a, Ren Huai-Hui (任淮辉)a b |
a Department of Engineering Mechanics, AML, Tsinghua University, Beijing 100084, China;
b China Longyuan Power Group Corporation Limited, China Goudian, Beijing 100034, China |
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Abstract High density package is developing toward miniaturization and integration, which causes many difficulties in designing, manufacturing, and reliability testing. Package-on-Package (PoP) is a promising three-dimensional high-density packaging method that integrates chip scale package (CSP) in the top package and fine-pitch ball grid array (FBGA) in the bottom package. In this paper, in-situ scanning electron microscopy (SEM) observation is carried out to detect the deformation and damage of the PoP structure under three-point bending loading. The results indicate that the cracks occur in the die of the top package, then cause the crack deflection and bridging in the die attaching layer. Furthermore, the mechanical principles are used to analyse the cracking process of the PoP structure based on the multi-layer laminating hypothesis. And the theoretical analysis results are found to be in good agreement with the experimental results.
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Received: 10 May 2012
Revised: 23 July 2012
Accepted manuscript online:
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PACS:
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62.20.M-
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(Structural failure of materials)
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85.85.+j
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(Micro- and nano-electromechanical systems (MEMS/NEMS) and devices)
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46.50.+a
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(Fracture mechanics, fatigue and cracks)
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46.70.-p
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(Application of continuum mechanics to structures)
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| Fund: Projects supported by the National Natural Science Foundation of China (Grant Nos. 11072124 and 11272173), the National Basic Research Program of China (Grant No. 2010CB631006), and the State Key Laboratory of Advanced Metals and Materials, China (Grant No. 2010ZD-04). |
Corresponding Authors:
Wang Xi-Shu
E-mail: xshwang@tsinghua.edu.cn
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Cite this article:
Jia Su (贾苏), Wang Xi-Shu (王习术), Ren Huai-Hui (任淮辉) Experimental and theoretical analysis of package-on-package structure under three-point bending loading 2012 Chin. Phys. B 21 126201
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| [1] |
Yoshida A, Taniguchi J, Murata K, Kada M, Yamamoto Y, Takagi Y, Notomi T and Fujita A 2006 Proceedings of the 56th Electronic Components and Technology Conference (San Diego: Institute of Electrical and Electronics Engineers)
|
| [2] |
Dreiza M, Yoshida A, Ishibashi K and Maeda T 2007 Proceedings of the 57th Electronic Components and Technology Conference (Reno: Institute of Electrical and Electronics Engineers)
|
| [3] |
Tian M B 2003 Electronic Packaging Technology (Beijing: Tsinghua University Press) p. 20 (in Chinese)
|
| [4] |
Sawada Y, Yamaguchi A, Oka S and Fujioka H 1998 IEMT/IMC Symposium (Tokyo: IEEE CPMT Society)
|
| [5] |
Lin J C, Yu J, Chung B, Chang K and Fang D 2011 Proceedings of the 61st Electronic Components and Technology Conference (Lake Buena Vista: Institute of Electrical and Electronics Engineers)
|
| [6] |
Sommer J P, Michel B, Hofmann T, Gottwald T, Neumann A and Podlasly A 2011 Electronic Packaging Technology & High Density Packaging (Shanghai: Electronic Manufacturing and Packaging Technology Society)
|
| [7] |
International Technology Roadmap for Semiconductors (ITRS)-Assembly and Packaging 2007 available: http://www.itrs.net/Links/2007ITRS/Home2007.htm
|
| [8] |
Winkler S 2007 Advanced IC Packaging (Electronic Trend Publications Inc.)
|
| [9] |
Lee J Y, Hwang T K, Kim J Y, Yoo M, Sohn E S, Chung J Y and Dreiza M 2007 Proceedings of the 57th Electronic Components and Technology Conference (Reno: Institute of Electrical and Electronics Engineers)
|
| [10] |
Zhang G C, Feng S W, Zhou Z, Li J W and Guo C S 2011 Chin. Phys. B 20 027202
|
| [11] |
Sun P, Leung V C, Xie B, Ma V W and Shi D X 2008 Electronic Packaging Technology & High Density Packaging (Shanghai: Electronic Manufacturing and Packaging Technology Society)
|
| [12] |
Wang X S, Li Y and Meng X K 2009 Sci. Chin. E: Tech. Sci. 52 2201
|
| [13] |
Amagai M, Suzuki Y, Abe K, Kim Y B and Sano H 2008 Proceedings of the 58th Electronic Components and Technology Conference (Lake Buena Vista: Institute of Electrical and Electronics Engineers)
|
| [14] |
Lee S R, Lui B H W, Kong Y H, Baylon B, Leung T, Umall P and Agtarap H 2002 Soldering & Surface Mount Tech. 14 46
|
| [15] |
Yao B, Lai P, Liu J and Liang X S. 2011 International Symposium on Advanced Packaging Materials (Xiamen: IEEE's Components Packaging and Manufacturing Technology Society)
|
| [16] |
Liu H L and Yang S H 2011 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (Xi'an: Institute of Electrical and Electronics Engineers)
|
| [17] |
Lau H J, Pan H S and Chang C 2001 Int. J. Microcircuit and Electronic Packaging 24 1
|
| [18] |
Wang X S, Li X D, Ren H H, Zhao H Y and Murai R 2011 Microelectron. Reliab. 51 1377
|
| [19] |
Ren H H, Wang X S, Chen Y L and Li X D 2012 Chin. Phys. B 21 034501
|
| [20] |
Wang X S, Xu Y and Xu Q X 2004 Appl. Compos. Mater. 11 145
|
| [21] |
Wang X S, Wu B S and Wang Q Y 2005 Cement and Concrete Res. 35 1385
|
| [22] |
Wang X S, Ji L, Li Y and Guo X W 2008 Mater. Lett. 62 1856
|
| [23] |
Sun P, Leung V, Yang D, Lou R, Shi D and Chung T 2010 Proceedings of the 60th Electronic Components and Technology Conference (Las Vegas: Institute of Electrical and Electronics Engineers)
|
| [24] |
Fan Q S and Yin Y J 2004 Material Mechanics (Beijing: Tsinghua University Press) p. 90 (in Chinese)
|
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