Please wait a minute...
Chin. Phys. B, 2011, Vol. 20(6): 060508    DOI: 10.1088/1674-1056/20/6/060508
GENERAL Prev   Next  

Heat transport in coupled inhomogeneous chains

Hu Tao (胡涛), Bai Meng (白萌), Hu Ke (胡柯), Tang Yi (唐翌)
Department of Physics, Xiangtan University, Xiangtan 411105, China
Abstract  We first investigate the heat transport in a network model consisting of two coupled dimerized chains. Results indicate that the thermal resistance of each chain increases with the decrease of the mass ratio $\gamma$ of the two types of atoms. Then, we find, when a light impurity or a heavy one is added in the two coupled homogeneous chains and coupled with a particle of another chain, the interface thermal resistances $R_{\rm int}^l$ and $R_{\rm int}^r$ present different dependences on the mass ratio $\gamma'$. Finally, a persistent circulation of energy current is observed in coupled inhomogeneous chains with two pairs of interchain coupling.
Keywords:  heat transport      thermal resistance  
Received:  26 October 2010      Revised:  17 December 2010      Accepted manuscript online: 
PACS:  05.70.Ln (Nonequilibrium and irreversible thermodynamics)  
  44.10.+i (Heat conduction)  
  05.45.-a (Nonlinear dynamics and chaos)  
  05.06.Cd  
Fund: Project supported by the Key Project of the Educational Department of Hunan Province of China (Grant No. 04A058).

Cite this article: 

Hu Tao (胡涛), Bai Meng (白萌), Hu Ke (胡柯), Tang Yi (唐翌) Heat transport in coupled inhomogeneous chains 2011 Chin. Phys. B 20 060508

[1] Leperi S, Livi R and Politi A 2003 Phys. Rep. 377 1
[2] Chang C W, Okawa D, Majumdar A and Zettl A 2006 Science 314 1121
[3] Wei N, Wu G and Dong J M 2004 Phys. Lett. A 325 403
[4] Li H B and Li Z 2010 Chin. Phys. B 19 054401
[5] Terraneo M, Peyrard M and Casati G 2002 Phys. Rev. Lett. 88 094302
[6] Li B, Wang L and Casati G 2004 Phys. Rev. Lett. 93 184301
[7] Li B, Wang L and Casati G 2006 Appl. Phys. Lett. 88 143501
[8] Wang L and Li B 2007 Phys. Rev. Lett. 99 177208
[9] Li B, Lan J H and Wang L 2005 Phys. Rev. Lett. 95 104302
[10] Kou J L, Lu H J, Wu F M and Xu Y S 2009 Chin. Phys. B 18 1553
[11] Rieder Z, Lebowitz J L and Lieb E 1967 J. Math. Phys. 8 1073
[12] Hu B, Li B and Zhao H 2000 Phys. Rev. E 61 3828
[13] Casati G, Ford J, Vivaldi F and Visscher W M 1984 Phys. Rev. Lett. 52 1861
[14] Hu B, Li B and Zhao H 1998 Phys. Rev. E 57 2992
[15] Chen D, Aubry S and Tsironis G P 1996 Phys. Rev. Lett. 77 4776
[16] Gendelman O V and Savin V A 2000 Phys. Rev. Lett. 84 2381
[17] Li B, Wang J, Wang L and Zhang G 2005 Chaos 15 015121
[18] Lepri S, Livi R and Politi A 1997 Phys. Rev. Lett. 78 1896
[19] Hatano T 1999 Phys. Rev. E 59 R1
[20] Liu Z H and Li B 2007 Phys. Rev. E 76 051118
[21] Huang K and Han R 1988 Solid State Physics (Beijing: Higher Education Press) p. 92 (in Chinese)
[22] König G and Stollhoff G 1990 Phys. Rev. Lett. 65 1239
[23] Gupta B C and Batra I P 2005 Phys. Rev. B 71 165429
[24] Hase M, Terasaki I and Uchinokura K 1993 Phys. Rev. Lett. 70 3651
[25] Toda M 1979 Phys. Scr. 20 424
[26] Dorogovtsev S N and Mendes J F F 2002 Adv. Phys. 51 1079
[27] Eckmann J P and Zabey E 2004 J. Stat. Phys. 114 515
[1] Modeling of thermal conductivity for disordered carbon nanotube networks
Hao Yin(殷浩), Zhiguo Liu(刘治国), and Juekuan Yang(杨决宽). Chin. Phys. B, 2023, 32(4): 044401.
[2] Thermal resistance matrix representation of thermal effects and thermal design of microwave power HBTs with two-dimensional array layout
Rui Chen(陈蕊), Dong-Yue Jin(金冬月), Wan-Rong Zhang(张万荣), Li-Fan Wang(王利凡), Bin Guo(郭斌), Hu Chen(陈虎), Ling-Han Yin(殷凌寒), Xiao-Xue Jia(贾晓雪). Chin. Phys. B, 2019, 28(9): 098502.
[3] Thermal transport in phosphorene and phosphorene-based materials: A review on numerical studies
Yang Hong(洪扬), Jingchao Zhang(张景超), Xiao Cheng Zeng(曾晓成). Chin. Phys. B, 2018, 27(3): 036501.
[4] Accomplishment and challenge of materials database toward big data
Yibin Xu(徐一斌). Chin. Phys. B, 2018, 27(11): 118901.
[5] Transient thermal analysis as measurement method for IC package structural integrity
Alexander Hanß, Maximilian Schmid, E Liu, Gordon Elger. Chin. Phys. B, 2015, 24(6): 068105.
[6] Interfacial thermal resistance between high-density polyethylene (HDPE) and sapphire
Zheng Kun (郑鲲), Zhu Jie (祝捷), Ma Yong-Mei (马永梅), Tang Da-Wei (唐大伟), Wang Fo-Song (王佛松). Chin. Phys. B, 2014, 23(10): 107307.
[7] Optimization of fin geometry in heat convection with entransy theory
Cheng Xue-Tao (程雪涛), Zhang Qin-Zhao (张勤昭), Xu Xiang-Hua (徐向华), Liang Xin-Gang (梁新刚). Chin. Phys. B, 2013, 22(2): 020503.
[8] Thermal resistance matrix representation of thermal effects and thermal design in multi-finger power heterojunction bipolar transistors
Jin Dong-Yue(金冬月), Zhang Wan-Rong(张万荣), Chen Liang(陈亮), Fu Qiang(付强), Xiao Ying(肖盈), Wang Ren-Qing(王任卿), and Zhao Xin(赵昕). Chin. Phys. B, 2011, 20(6): 064401.
[9] Measurements of electron–phonon coupling factor and interfacial thermal resistance of metallic nano-films using a transient thermoreflectance technique
Wang Hai-Dong(王海东), Ma Wei-Gang(马维刚), Guo Zeng-Yuan(过增元), Zhang Xing(张兴), and Wang Wei(王玮) . Chin. Phys. B, 2011, 20(4): 040701.
No Suggested Reading articles found!