Please wait a minute...
Chin. Phys. B, 2020, Vol. 29(8): 087303    DOI: 10.1088/1674-1056/ab973e
CONDENSED MATTER: ELECTRONIC STRUCTURE, ELECTRICAL, MAGNETIC, AND OPTICAL PROPERTIES Prev   Next  

High crystalline quality of SiGe fin fabrication with Si-rich composition area using replacement fin processing

Ying Zan(昝颖), Yong-Liang Li(李永亮), Xiao-Hong Cheng(程晓红), Zhi-Qian Zhao(赵治乾), Hao-Yan Liu(刘昊炎), Zhen-Hua Hu(吴振华), An-Yan Du(都安彦), Wen-Wu Wang(王文武)
Integrated Circuit Advanced Process Center, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China
Abstract  A high crystalline quality of SiGe fin with an Si-rich composition area using the replacement fin processing is systematically demonstrated in this paper. The fin replacement process based on a standard FinFET process is developed. A width of less than 20-nm SiGe fin without obvious defect impact both in the direction across the fin and in the direction along the fin is verified by using the high angle annular dark field scanning transmission electron microscopy and the scanning moiré fringe imaging technique. Moreover, the SiGe composition is inhomogenous in the width of the fin. This is induced by the formation of 111 facets. Due to the atomic density of the 111 facets being higher, the epitaxial growth in the direction perpendicular to these facets is slower than in the direction perpendicular to 001. The Ge incorporation is then higher on the 111 facets than on the 001 facets. So, an Si-rich area is observed in the central area and on the bottom of SiGe fin.
Keywords:  SiGe      selective epitaxial growth      FinFET      replacement fin processing  
Received:  29 April 2020      Revised:  25 May 2020      Accepted manuscript online: 
PACS:  73.22.-f (Electronic structure of nanoscale materials and related systems)  
  73.61.-r (Electrical properties of specific thin films)  
Fund: Project supported by the Beijing Municipal Natural Science Foundation, China (Grant No. 4202078) and the National Key Project of Science and Technology of China (Grant No. 2017ZX02315001-002).
Corresponding Authors:  Yong-Liang Li     E-mail:  liyongliang@ime.ac.cn

Cite this article: 

Ying Zan(昝颖), Yong-Liang Li(李永亮), Xiao-Hong Cheng(程晓红), Zhi-Qian Zhao(赵治乾), Hao-Yan Liu(刘昊炎), Zhen-Hua Hu(吴振华), An-Yan Du(都安彦), Wen-Wu Wang(王文武) High crystalline quality of SiGe fin fabrication with Si-rich composition area using replacement fin processing 2020 Chin. Phys. B 29 087303

[1] Capogreco E, Witters L, Arimura H, Sebaai F, Porret C, Hikavyy A, Loo R, Milenin A P, Eneman G, Favia P, Bender H, Wostyn K, Dentoni E L, Schulze A, Vrancken C, Opdebeeck A, Mitard J, Langer R, Holsteyns F, Waldron N, Barla K, Heyn V D, Mocuta D and Collaert N 2018 IEEE Trans. Electron Dev. 65 5145
[2] Huang M L, Chang S W, Chen M K, Oniki Y, Chen H C, Lin C H, Lee W C, Lin C H, Khaderbad M A, Lee K Y, Chen Z C, Tsai P Y, Lin L T, Tsai M H, Hung C L, Huang T C, Lin Y C, Yeo Y C, Jang S M, Hwang H Y, Wang H C H and Diaz C H 2016 IEEE Symposium on VLSI Technology, June 14-16, 2016, Honolulu, HI, USA, p. 1
[3] Lee C H, Southwick R G, Mochizuki S, Li J, Miao X, Wang M, Bao R, Ok I, Ando T, Hashemi P, Guo D, Narayanan V, Loubet N and Jagannathan H 2018 International Electron Devices Meeting, December 1-5, 2018, San Francisco, CA, USA, p. 807
[4] Mertens H, Ritzenthaler R, Arimura H, Franco J, Sebaai F, Hikavyy A, Pawlak B J, Machkaoutsan V, Devriendt K, Tsvetanova D, Milenin A P, Witters L, Dangol A, Vancoille E, Bender H, Badaroglu M, Holsteyns F, Barla K, Mocuta D, Horiguchi N and Thean A V 2015 Symposium on VLSI Technology, June 16-18, 2015, Kyoto, Japan, p. 142
[5] Witters L, Mitard J, Loo R, Demuynck S, Chew S A, Schram T, Tao Z, Hikavyy A, Sun J W, Milenin A P, Mertens H, Vrancken C, Favia P, Schaekers M, Bender H, Horiguchi N, Langer R, Barla K, Mocuta D, Collaert N and Thean A V 2015 Symposium on VLSI Technology, June 16-18, 2015, Kyoto, Japan, p. 56
[6] Witters L, Sebaai F, Hikavyy A, Milenin A P, Loo R, Keersgieter A D, Eneman G, Schram T Wostyn K, Devriendt K, Schulze A, Lieten R, Bilodeau S, Cooper E, Storck P, Vrancken C, Arimura H, Favia P, Vancoille E, Mitard J, Langer R, Opdebeeck A, Holsteyns F, Waldron N, Barla K, Heyn V D Mocuta D and Collaert N 2017 Symposium on VLSI Technology, June 5-8, 2017, Kyoto, Japan, p. 194
[7] Koo S, Jang H and Ko D H 2017 J. Korean Phys. Soc. 70 714
[8] Luo G L,Huang S C, Ko C H, Wann C H, Chung C T, Han Z Y, Cheng C C, Chang C Y, Lin H Y and Chien C H 2009 J. Electrochem. Soc. 156 703
[9] Vellianitis G, Dal M J H V, Duriez B, Lee T L, Passlack M, Wann C H and Diaz C H 2013 J. Crystal Growth 383 9
[10] Mertens H, Ritzenthaler R, Hikavyy A, Franco J, Lee J W, Brunco1 D P, Eneman G, Witters L, Mitard J, Kubicek S, Devriendt K, Tsvetanova D, Milenin A P, Vrancken C, Geypen J, Bender H, Groeseneken G, Vandervorst W, Barla K, Collaert N, Horiguchi N and Thean A V Y 2014 Symposium on VLSI Technology, June 9-12, 2014, Honolulu, HI, USA
[11] Yu E, Lee W J, Jung J and Cho S 2018 IEEE Trans. Electron. Dev. 65 1290
[12] Loo R, Hikavyy A Y, Witters L, Schulze A, Arimura H, Cott D, Mitard J, Porret C, Mertens H, Ryan P, Wall J, Matney K, Wormington M, Favia P, Richard O, Bender H, Thean A, Horiguchi N, Mocuta D and Collaert N 2017 ECS J. Solid State Sci. Technol. 6 14
[13] Mitard J, Witters L, Loo R, Lee S H, Sun J W, Franco J, Ragnarsson L A, Brand A, Lu X, Yoshida N, Eneman G, Brunco D P, Vorderwestner M, Storck P, Milenin A P, Hikavyy A, Waldron N, Favia P, Vanhaeren D, Vanderheyden A, Olivier R, Mertens H, Arimura H, Sonja S, Vrancken C, Bender H, Eyben P, Barla K, Lee S G, Horiguchi N, Collaert N and Thean A V 2014 Symposium on VLSI Technology, June 9-12, 2014, Honolulu, HI, USA
[14] Vincent B, Witters L, Richard O, Hikavyy A, Bender H, Loo R, Caymax M and Thean A 2012 ECS Transactions 50 39
[1] Strategy to mitigate single event upset in 14-nm CMOS bulk FinFET technology
Dong-Qing Li(李东青), Tian-Qi Liu(刘天奇), Pei-Xiong Zhao(赵培雄), Zhen-Yu Wu(吴振宇), Tie-Shan Wang(王铁山), and Jie Liu(刘杰). Chin. Phys. B, 2022, 31(5): 056106.
[2] Impact of incident direction on neutron-induced single-bit and multiple-cell upsets in 14 nm FinFET and 65 nm planar SRAMs
Shao-Hua Yang(杨少华), Zhan-Gang Zhang(张战刚), Zhi-Feng Lei(雷志锋), Yun Huang(黄云), Kai Xi(习凯), Song-Lin Wang(王松林), Tian-Jiao Liang(梁天骄), Teng Tong(童腾), Xiao-Hui Li(李晓辉), Chao Peng(彭超), Fu-Gen Wu(吴福根), and Bin Li(李斌). Chin. Phys. B, 2022, 31(12): 126103.
[3] Dependence of short channel length on negative/positive bias temperature instability (NBTI/PBTI) for 3D FinFET devices
Ren-Ren Xu(徐忍忍), Qing-Zhu Zhang(张青竹), Long-Da Zhou(周龙达), Hong Yang(杨红), Tian-Yang Gai(盖天洋), Hua-Xiang Yin(殷华湘), and Wen-Wu Wang(王文武). Chin. Phys. B, 2022, 31(1): 017301.
[4] Sphere-shaped SiGe micro/nanostructures with tunable Ge composition and size formed by laser irradiation
Xinxin Li(李欣欣), Zhen Deng(邓震), Sen Wang(王森), Jinbiao Liu(刘金彪), Jun Li(李俊), Yang Jiang(江洋), Ziguang Ma(马紫光), Chunhua Du(杜春花), Haiqiang Jia(贾海强), Wenxin Wang(王文新), and Hong Chen(陈弘). Chin. Phys. B, 2021, 30(9): 096104.
[5] Microstructure and ferromagnetism of heavily Mn doped SiGe thin flims
Huanming Wang(王焕明), Sen Sun(孙森), Jiayin Xu(徐家胤), Xiaowei Lv(吕晓伟), Yuan Wang(汪渊), Yong Peng(彭勇), Xi Zhang(张析), Gang Xiang(向钢). Chin. Phys. B, 2020, 29(5): 057504.
[6] Effects of buried oxide layer on working speed of SiGe heterojunction photo-transistor
Xian-Cheng Liu(刘先程), Jia-Jun Ma(马佳俊), Hong-Yun Xie(谢红云), Pei Ma(马佩), Liang Chen(陈亮), Min Guo(郭敏), Wan-Rong Zhang(张万荣). Chin. Phys. B, 2020, 29(2): 028501.
[7] PBTI stress-induced 1/ f noise in n-channel FinFET
Dan-Yang Chen(陈丹旸), Jin-Shun Bi(毕津顺), Kai Xi(习凯), and Gang Wang(王刚). Chin. Phys. B, 2020, 29(12): 128501.
[8] Impact of proton-induced alteration of carrier lifetime on single-event transient in SiGe heterojunction bipolar transistor
Jia-Nan Wei(魏佳男), Chao-Hui He(贺朝会), Pei Li(李培), Yong-Hong Li(李永宏), Hong-Xia Guo(郭红霞). Chin. Phys. B, 2019, 28(7): 076106.
[9] Characteristics and threshold voltage model of GaN-based FinFET with recessed gate
Chong Wang(王冲), Xin Wang(王鑫), Xue-Feng Zheng(郑雪峰), Yun Wang(王允), Yun-Long He(何云龙), Ye Tian(田野), Qing He(何晴), Ji Wu(吴忌), Wei Mao(毛维), Xiao-Hua Ma(马晓华), Jin-Cheng Zhang(张进成), Yue Hao(郝跃). Chin. Phys. B, 2018, 27(9): 097308.
[10] Influence of fin architectures on linearity characteristics of AlGaN/GaNFinFETs
Ting-Ting Liu(刘婷婷), Kai Zhang(张凯), Guang-Run Zhu(朱广润), Jian-Jun Zhou(周建军), Yue-Chan Kong(孔月婵), Xin-Xin Yu(郁鑫鑫), Tang-Sheng Chen(陈堂胜). Chin. Phys. B, 2018, 27(4): 047307.
[11] Synergistic effect of total ionizing dose on single event effect induced by pulsed laser microbeam on SiGe heterojunction bipolar transistor
Jin-Xin Zhang(张晋新), Hong-Xia Guo(郭红霞), Xiao-Yu Pan(潘霄宇), Qi Guo(郭旗), Feng-Qi Zhang(张凤祁), Juan Feng(冯娟), Xin Wang(王信), Yin Wei(魏莹), Xian-Xiang Wu(吴宪祥). Chin. Phys. B, 2018, 27(10): 108501.
[12] Improved high-frequency equivalent circuit model based on distributed effects for SiGe HBTs with CBE layout
Ya-Bin Sun(孙亚宾), Xiao-Jin Li(李小进), Jin-Zhong Zhang(张金中), Yan-Ling Shi(石艳玲). Chin. Phys. B, 2017, 26(9): 098502.
[13] Three-dimensional simulation of fabrication process-dependent effects on single event effects of SiGe heterojunction bipolar transistor
Jin-Xin Zhang(张晋新), Chao-Hui He(贺朝会), Hong-Xia Guo(郭红霞), Pei Li(李培), Bao-Long Guo(郭宝龙), Xian-Xiang Wu(吴宪祥). Chin. Phys. B, 2017, 26(8): 088502.
[14] An analytical model for nanowire junctionless SOI FinFETs with considering three-dimensional coupling effect
Fan-Yu Liu(刘凡宇), Heng-Zhu Liu(刘衡竹), Bi-Wei Liu(刘必慰), Yu-Feng Guo(郭宇峰). Chin. Phys. B, 2016, 25(4): 047305.
[15] Extraction of temperature dependences of small-signal model parameters in SiGe HBT HICUM model
Ya-Bin Sun(孙亚宾), Jun Fu(付军), Yu-Dong Wang(王玉东), Wei Zhou(周卫), Wei Zhang(张伟), and Zhi-Hong Liu(刘志弘). Chin. Phys. B, 2016, 25(4): 048501.
No Suggested Reading articles found!