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Chin. Phys. B, 2020, Vol. 29(6): 067203    DOI: 10.1088/1674-1056/ab8895
CONDENSED MATTER: ELECTRONIC STRUCTURE, ELECTRICAL, MAGNETIC, AND OPTICAL PROPERTIES Prev   Next  

Experimental evaluation of interface states during time-dependent dielectric breakdown of GaN-based MIS-HEMTs with LPCVD-SiNx gate dielectric

Ya-Wen Zhao(赵亚文)1, Liu-An Li(李柳暗)1, Tao-Tao Que(阙陶陶)1, Qiu-Ling Qiu(丘秋凌)1, Liang He(何亮)2, Zhen-Xing Liu(刘振兴)1, Jin-Wei Zhang(张津玮)1, Qian-Shu Wu(吴千树)1, Jia Chen(陈佳)1, Zhi-Sheng Wu(吴志盛)1, Yang Liu(刘扬)1
1 School of Electronics and Information Technology, Sun Yat-Sen University, Guangzhou 510275, China;
2 School of Materials Science and Engineering, Sun Yat-Sen University, Guangzhou 510275, China
Abstract  We experimentally evaluated the interface state density of GaN MIS-HEMTs during time-dependent dielectric breakdown (TDDB). Under a high forward gate bias stress, newly increased traps generate both at the SiNx/AlGaN interface and the SiNx bulk, resulting in the voltage shift and the increase of the voltage hysteresis. When prolonging the stress duration, the defects density generated in the SiNx dielectric becomes dominating, which drastically increases the gate leakage current and causes the catastrophic failure. After recovery by UV light illumination, the negative shift in threshold voltage (compared with the fresh one) confirms the accumulation of positive charge at the SiNx/AlGaN interface and/or in SiNx bulk, which is possibly ascribed to the broken bonds after long-term stress. These results experimentally confirm the role of defects in the TDDB of GaN-based MIS-HEMTs.
Keywords:  GaN-based MIS-HEMTs      gate dielectric      time-dependent dielectric breakdown      interface states  
Received:  26 February 2020      Revised:  01 April 2020      Accepted manuscript online: 
PACS:  72.80.Ey (III-V and II-VI semiconductors)  
  72.80.Sk (Insulators)  
  73.20.At (Surface states, band structure, electron density of states)  
  77.22.Jp (Dielectric breakdown and space-charge effects)  
Fund: Project supported by the National Key Research and Development Program of China (Grant No. 2017YFB0402800), the Key Research and Development Program of Guangdong Province, China (Grant Nos. 2019B010128002 and 2020B010173001), the National Natural Science Foundation of China (Grant Nos. U1601210 and 61904207), the Natural Science Foundation of Guangdong Province of China (Grant No. 2015A030312011), and the China Postdoctoral Science Foundation (Grant No. 2019M663233).
Corresponding Authors:  Yang Liu     E-mail:  liuy69@mail.sysu.edu.cn

Cite this article: 

Ya-Wen Zhao(赵亚文), Liu-An Li(李柳暗), Tao-Tao Que(阙陶陶), Qiu-Ling Qiu(丘秋凌), Liang He(何亮), Zhen-Xing Liu(刘振兴), Jin-Wei Zhang(张津玮), Qian-Shu Wu(吴千树), Jia Chen(陈佳), Zhi-Sheng Wu(吴志盛), Yang Liu(刘扬) Experimental evaluation of interface states during time-dependent dielectric breakdown of GaN-based MIS-HEMTs with LPCVD-SiNx gate dielectric 2020 Chin. Phys. B 29 067203

[1] Chen K, Häberlen O, Lidow A, et al. 2017 IEEE Trans. Electron. Dev. 64 779
[2] Hua M, Liu C, Yang S, et al. 2015 IEEE Electron Dev. Lett. 36 448
[3] Li L, Zhang J, Liu Y and Ao J 2016 Chin. Phys. B 25 038503
[4] Sun H, Wang M, Chen J, et al. 2018 IEEE Trans. Electron. Dev. 65 4814
[5] Warnock S, Lemus A, Joh J, et al. 2018 IEEE Trans. Electron. Dev. 64 3132
[6] Wu T, Marcon D, Brice J, et al. 2015 IEEE Int. Rel. Phys. Symp. 6C.4.1
[7] Shireen W and Alamo J 2017 Proc. IEEE Int. Rel. Phys. Symp. 4B-3.1
[8] Qi Y, Zhu Y, Zhang J, et al. 2018 IEEE Trans. Electron. Dev. 65 1759
[9] Bisi D, Chan S, Tahhan M, et al. 2016 Proc. Int. Symp. Power Semicond. Dev. ICs. 119
[10] Jauss S, Hallaceli K, Mansfeld S, et al. 2017 IEEE Trans. Electron. Dev. 64 2298
[11] Lagger P, Ostermaier C, Pobegen G, et al. 2012 Proc. IEEE IEDM 299
[12] Wu T, Marcon D, Zahid M, et al. 2013 Proc. IEEE Int. Rel. Phys. Symp. 3C.5.1
[13] Lu X, Yu K, Jiang H, et al. 2017 IEEE Trans. Electron. Dev. 64 824
[14] Zhang J, He L, Li L, et al. 2018 IEEE Electron Dev. Lett. 39 1720
[15] Swain R, Jena K, Lenka T and 2016 IEEE Trans. Electron. Dev. 63 3246
[16] Banerjee A, Vanmeerbeek P, Schepper L, et al. 2016 Proc. IEEE Int. Rel. Phys. Symp. CD-1-1
[17] Zhu J, Ma X, Hou B, et al. 2014 J. Appl. Phys. 104 133510
[18] Hua M, Liu C, Yang S, et al. 2015 IEEE Trans. Electron Dev. 62 3215
[19] McPherson J 2012 Microelectronics Reliability 52 1753
[20] Meneghesso G, Meneghini M, Bisi D, et al. 2016 Microelectronics Reliability 58 151
[21] Que T, Zhao Y, Li L, et al. 2020 Chin. Phys. B 29 037201
[22] Guo A and Alamo J 2017 IEEE Trans. Electron Dev. 64 2142
[23] Ma X, Chen W, Hou B, et al. 2008 J. Appl. Phys. 104 093504
[24] Zhu J, Ma X, Hou B, et al. 2018 IEEE Trans. Electron Dev. 65 5343
[25] Guo A and Alamo J 2016 IEEE Int. Rel. Phys. Symp. 4A-1-1
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