Heat transfer of liquid metal alloy on copper plate deposited with film of different surface free energy

doi:10.1088/1674-1056/ab48dc

Abstract Liquid metal alloys (LMAs) are the potential candidates of thermal interface materials (TIMs) for electronics cooling. In the present work, buffer layers of Ag, Ti, Cu, Ni, Mo, and W were deposited on polished Cu plates by DC magnetron sputtering, the contact angles of de-ionized water and diiodomethane on the buffer layers were measured by an easy drop shape analyzer and the surface free energies (SFEs) of the buffer layers were calculated by the Owens-Wendt-Kaelble equation. Samples were prepared by sandwiching the filmed Cu plates and LMAs. The thermal properties of the samples were measured by laser flash analysis method. The SFE of the buffer layer has a strong influence on the interface heat transfer, whereas the measurement temperature has no obvious effect on the thermal properties of the samples. As the SFE of the buffer layer increases, the wettability, thermal diffusivity, and thermal conductivity are enhanced, and the thermal contact resistance is decreased.

Keywords: buffer layer liquid metal alloy thermal contact resistance heat transfer surface free energy

Received: 15 April 2019
Revised: 23 September 2019
Accepted manuscript online:

PACS:	44.10.+i	(Heat conduction)
	68.08.-p	(Liquid-solid interfaces)
	65.40.gp	(Surface energy)
	68.08.Bc	(Wetting)

Fund: Project supported by the National Natural Science Foundation of China (Grant No. 11874191) and the Natural Science Foundation of Shandong Province, China (Grant No. ZR2016FM38).

Corresponding Authors: Huilong Yan, Jinliang Yan
E-mail: 18742514109@163.com;yanjinliang8@sina.com

Cite this article:

Huilong Yan(闫慧龙), Jinliang Yan(闫金良), Gang Zhao(赵刚) Heat transfer of liquid metal alloy on copper plate deposited with film of different surface free energy 2019 Chin. Phys. B 28 114401

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Heat transfer of liquid metal alloy on copper plate deposited with film of different surface free energy

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