| CONDENSED MATTER: STRUCTURAL, MECHANICAL, AND THERMAL PROPERTIES |
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Mechanism of microweld formation and breakage during Cu-Cu wire bonding investigated by molecular dynamics simulation |
| Beikang Gu(顾倍康)1, Shengnan Shen(申胜男)1,2,†, and Hui Li(李辉)1,2,‡ |
1 School of Power and Mechanical Engineering, Wuhan University, Wuhan 430072, China;
2 The Institute of Technological Sciences, Wuhan University, Wuhan 430072, China |
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Abstract Currently, wire bonding is the most popular first-level interconnection technology used between the die and package terminals, but even with its long-term and excessive usage, the mechanism of wire bonding has not been completely evaluated. Therefore, fundamental research is still needed. In this study, the mechanism of microweld formation and breakage during Cu-Cu wire bonding was investigated by using molecular dynamics simulation. The contact model for the nanoindentation process between the wire and substrate was developed to simulate the contact process of the Cu wire and Cu substrate. Elastic contact and plastic instability were investigated through the loading and unloading processes. Moreover, the evolution of the indentation morphology and distributions of the atomic stress were also investigated. It was shown that the loading and unloading curves do not coincide, and the unloading curve exhibited hysteresis. For the substrate, in the loading process, the main force changed from attractive to repulsive. The maximum von Mises stress increased and shifted from the center toward the edge of the contact area. During the unloading process, the main force changed from repulsive to attractive. The Mises stress reduced first and then increased. Stress concentration occurs around dislocations in the middle area of the Cu wire.
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Received: 10 March 2021
Revised: 21 June 2021
Accepted manuscript online: 24 June 2021
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PACS:
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61.46.-w
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(Structure of nanoscale materials)
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02.70.Ns
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(Molecular dynamics and particle methods)
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02.70.-c
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(Computational techniques; simulations)
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61.82.Bg
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(Metals and alloys)
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| Fund: Project supported by the National Key R&D Program of China (Grant No. 2019YFB1704600) and the Hubei Provincial Natural Science Foundation of China (Grant No. 2020CFA032). |
Corresponding Authors:
Shengnan Shen, Hui Li
E-mail: shen_shengnan@whu.edu.cn;li_hui@whu.edu.cn
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Cite this article:
Beikang Gu(顾倍康), Shengnan Shen(申胜男), and Hui Li(李辉) Mechanism of microweld formation and breakage during Cu-Cu wire bonding investigated by molecular dynamics simulation 2022 Chin. Phys. B 31 016101
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