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Chin. Phys. B, 2014, Vol. 23(3): 038201    DOI: 10.1088/1674-1056/23/3/038201
INTERDISCIPLINARY PHYSICS AND RELATED AREAS OF SCIENCE AND TECHNOLOGY Prev   Next  

Residual stress induced wetting variation on electric brush-plated Cu film

Meng Ke-Ke, Jiang Yue, Jiang Zhong-Hao, Lian Jian-She, Jiang Qing
Key Laboratory of Automobile Materials, Department of Materials Science and Engineering, Jilin University, Changchun 130025, China
Abstract  Nanocrystalline Cu film with a mirror surface finishing is prepared by the electric brush-plating technique. The as-prepared Cu film exhibits a superhydrophilic behavior with an apparent water contact angle smaller than 10°. A subsequent increase in the water contact angle and a final wetting transition from inherent hydrophilicity with water contact angle smaller than 90° to apparent hydrophobicity with water contact angle larger than 90° are observed when the Cu film is subjected to natural aging. Analysis based on the measurement of hardness with nanoindentation and the theory of the bond-order-length-strength correlation reveals that this wetting variation on the Cu film is attributed to the relaxation of residual stress generated during brush-plating deposition and a surface hydrophobization role associated with the broken bond polarization induced by surface nanostructure.
Keywords:  superhydrophilicity      wetting transition      residual stress      nano indenter  
Received:  04 July 2013      Revised:  08 November 2013      Accepted manuscript online: 
PACS:  82.70.Uv (Surfactants, micellar solutions, vesicles, lamellae, amphiphilic systems, (hydrophilic and hydrophobic interactions))  
  61.30.Hn (Surface phenomena: alignment, anchoring, anchoring transitions, surface-induced layering, surface-induced ordering, wetting, prewetting transitions, and wetting transitions)  
  83.85.St (Stress relaxation ?)  
  62.20.Qp (Friction, tribology, and hardness)  
Fund: Project supported by the National Natural Science Foundations of China (Grant No. 51371089) and the Foundation of National Key Basic Research and Development Program of China (Grant No. 2010CB 631001).
Corresponding Authors:  Jiang Zhong-Hao     E-mail:  jzh@jlu.edu.cn

Cite this article: 

Meng Ke-Ke, Jiang Yue, Jiang Zhong-Hao, Lian Jian-She, Jiang Qing Residual stress induced wetting variation on electric brush-plated Cu film 2014 Chin. Phys. B 23 038201

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