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Chin. Phys. B, 2012, Vol. 21(12): 126201    DOI: 10.1088/1674-1056/21/12/126201
CONDENSED MATTER: STRUCTURAL, MECHANICAL, AND THERMAL PROPERTIES Prev   Next  

Experimental and theoretical analysis of package-on-package structure under three-point bending loading

Jia Sua, Wang Xi-Shua, Ren Huai-Huia b
a Department of Engineering Mechanics, AML, Tsinghua University, Beijing 100084, China;
b China Longyuan Power Group Corporation Limited, China Goudian, Beijing 100034, China
Abstract  High density package is developing toward miniaturization and integration, which causes many difficulties in designing, manufacturing, and reliability testing. Package-on-Package (PoP) is a promising three-dimensional high-density packaging method that integrates chip scale package (CSP) in the top package and fine-pitch ball grid array (FBGA) in the bottom package. In this paper, in-situ scanning electron microscopy (SEM) observation is carried out to detect the deformation and damage of the PoP structure under three-point bending loading. The results indicate that the cracks occur in the die of the top package, then cause the crack deflection and bridging in the die attaching layer. Furthermore, the mechanical principles are used to analyse the cracking process of the PoP structure based on the multi-layer laminating hypothesis. And the theoretical analysis results are found to be in good agreement with the experimental results.
Keywords:  high density package      in-situ SEM observation      three-point bending      multi-layer laminating hypothesis  
Received:  10 May 2012      Revised:  23 July 2012      Published:  01 November 2012
PACS:  62.20.M- (Structural failure of materials)  
  85.85.+j (Micro- and nano-electromechanical systems (MEMS/NEMS) and devices)  
  46.50.+a (Fracture mechanics, fatigue and cracks)  
  46.70.-p (Application of continuum mechanics to structures)  
Fund: Projects supported by the National Natural Science Foundation of China (Grant Nos. 11072124 and 11272173), the National Basic Research Program of China (Grant No. 2010CB631006), and the State Key Laboratory of Advanced Metals and Materials, China (Grant No. 2010ZD-04).
Corresponding Authors:  Wang Xi-Shu     E-mail:  xshwang@tsinghua.edu.cn

Cite this article: 

Jia Su, Wang Xi-Shu, Ren Huai-Hui Experimental and theoretical analysis of package-on-package structure under three-point bending loading 2012 Chin. Phys. B 21 126201

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