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Chin. Phys. B, 2011, Vol. 20(4): 040701    DOI: 10.1088/1674-1056/20/4/040701
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Measurements of electron–phonon coupling factor and interfacial thermal resistance of metallic nano-films using a transient thermoreflectance technique

Wang Hai-Dong(王海东)a), Ma Wei-Gang(马维刚) a), Guo Zeng-Yuan(过增元)a), Zhang Xing(张兴)a)†, and Wang Wei(王玮)b)
a Key Laboratory for Thermal Science and Power Engineering of Ministry of Education, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China; b Institute of Microelectronics, Peking University, Beijing 100871, China
Abstract  Using a transient thermoreflectance (TTR) technique, several Au films with different thicknesses on glass and SiC substrates are measured for thermal characterization of metallic nano-films, including the electron-phonon coupling factor G, interfacial thermal resistance R, and thermal conductivity Ks of the substrate. The rear heating-front detecting (RF) method is used to ensure the femtosecond temporal resolution. An intense laser beam is focused on the rear surface to heat the film, and another weak laser beam is focused on the very spot of the front surface to detect the change in the electron temperature. By varying the optical path delay between the two beams, a complete electron temperature profile can be scanned. Different from the normally used single-layer model, the double-layer model involving interfacial thermal resistance is studied here. The electron temperature cooling profile can be affected by the electron energy transfer into the substrate or the electron-phonon interactions in the metallic films. For multiple-target optimization, the genetic algorithm (GA) is used to obtain both G and R. The experimental result gives a deep understanding of the mechanism of ultra-fast heat transfer in metals.
Keywords:  transient thermoreflectance technique      electron–phonon coupling factor      interfacial thermal resistance      genetic algorithms  
Received:  27 August 2010      Revised:  26 October 2010      Accepted manuscript online: 
PACS:  07.20.-n (Thermal instruments and apparatus)  
  42.60.By (Design of specific laser systems)  
  63.20.kd (Phonon-electron interactions)  
Fund: Project supported by the National Natural Science Foundation of China (Grant Nos. 50730006, 50976053, and 50906042).

Cite this article: 

Wang Hai-Dong(王海东), Ma Wei-Gang(马维刚), Guo Zeng-Yuan(过增元), Zhang Xing(张兴), and Wang Wei(王玮) Measurements of electron–phonon coupling factor and interfacial thermal resistance of metallic nano-films using a transient thermoreflectance technique 2011 Chin. Phys. B 20 040701

[1] Smith A N and Calame J P 2004 Int. J. Thermophys. 25 409
[2] Majumdar A, Fushinobu K and Hijikata K 1995 J. Appl. Phys. 77 6686
[3] Stoner R J and Maris H J 1993 Phys. Rev. B 48 16373
[4] Sun H Y, Luo F F, He F, Liao Y and Xu J 2010 Chin. Phys. B 19 054210
[5] Ran L L, Qu S L and Guo Z Y 2010 Chin. Phys. B 19 034204
[6] Stevens R J, Smith A N and Norris P M 2005 J. Heat Transfer 127 315
[7] Lee S M and Cahill D G 1997 J. Appl. Phys. 81 2590
[8] Lambropoulos J C 1989 J. Appl. Phys. 66 4230
[9] Orain S, Scudeller Y and Brousse T 1999 Int. J. Thermal Sci. 39 537
[10] Norris P M, Caffrey A P, Stevens R J, Klopf J M, McLeskey J T and Smith A N 2003 Rev. Sci. Instrum. 74 400
[11] Hopkins P E, Kassebaum J L and Norris P M 2009 J. Appl. Phys. 105 023710
[12] Anisimov S I, Kapeliovich B L and Perelman T L 1974 Sov. Phys. --JETP 39 375
[13] Rosei R and Lynch D W 1972 Phys. Rev. B 5 3883
[14] Norris P M, Caffrey A P, Stevens R J, Klopf J M, McLeskey J T and Smith A N 2003 Rev. Sci. Instrum. 74 400
[15] Brorson S D, Kazeroonian A, Moodera J S, Face D W, Cheng T K, Ippen E P, Dresselhaus M S and Dresselhaus G 1990 Phys. Rev. Lett. 64 2172
[16] Hirori H, Tachizaki T, Matsuda O and Wright O B 2003 Phys. Rev. B 68 113102
[17] Qiu T Q and Tien C L 1994 Int. J. Heat Mass Transfer 37 2789
[18] Anisimov S I and Rethfeld B 1997 Nonresonant Laser-Matter Interaction (NLMI-9) 3093 192
[19] Tang D W and Araki N 1996 J. Phys. D: em Appl. Phys. 29 2527
[20] Chen J K, Tzou D Y and Beraun J E 2006 Int. J. Heat Mass Transfer 49 307
[21] Smith A N, Hostetler J L and Norris P M 1999 Numer. Heat Transfer A 35 859
[22] Chen J K, Latham W P and Beraun J E 2005 J. Laser Appl. 17 63
[23] Hopkins P E and Norris P M 2007 Appl. Surf. Sci. 253 6289
[24] Majumdar A and Reddy P 2004 Appl. Phys. Lett. 84 4768
[25] Roukes M L, Freeman M R, Germain R S, Richardson R C and Ketchen M B 1985 Phys. Rev. Lett. 55 422
[26] Qiu T Q and Tien C L 1993 J. Heat Transf. Trans. ASME 115 842
[27] Orain S, Scudeller Y, Garcia S and Brousse T 1999 Int. J. Heat Mass Transfer 44 3973
[28] Sahling S, Engert J, Gladun A and Knoner R 1981 J. Low Temp. Phys. 45 457
[29] Sakami D, Lahmar A, Scudeller Y, Danes F and Bardon J P 2001 J. Adhesion Sci. Technol. 15 1403 endfootnotesize
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