Chin. Phys. B
中国物理B  2017, Vol. 26 Issue (6): 060705    DOI: 10.1088/1674-1056/26/6/060705
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Design and characterization of a 3D encapsulation with silicon vias for radio frequency micro-electromechanical system resonator
Ji-Cong Zhao(赵继聪), Quan Yuan(袁泉), Feng-Xiang Wang(王凤祥), Xiao Kan(阚骁), Guo-Wei Han(韩国威), Ling Sun(孙玲), Hai-Yan Sun(孙海燕), Jin-Ling Yang(杨晋玲), Fu-Hua Yang(杨富华)
1 Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China;
2 School of Electronic, Electrical, and Communication Engineering, University of Chinese Academy of Sciences, Beijing 100049, China;
3 Jiangsu Key Laboratory of ASIC Design, Nantong University, Nantong 226019, China;
4 State Key Laboratory of Transducer Technology, Shanghai 200050, China
Design and characterization of a 3D encapsulation with silicon vias for radio frequency micro-electromechanical system resonator
Ji-Cong Zhao(赵继聪)1,3, Quan Yuan(袁泉)1, Feng-Xiang Wang(王凤祥)1,4, Xiao Kan(阚骁)1,4, Guo-Wei Han(韩国威)1, Ling Sun(孙玲)3, Hai-Yan Sun(孙海燕)3, Jin-Ling Yang(杨晋玲)1,2,4, Fu-Hua Yang(杨富华)1,2
1 Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China;
2 School of Electronic, Electrical, and Communication Engineering, University of Chinese Academy of Sciences, Beijing 100049, China;
3 Jiangsu Key Laboratory of ASIC Design, Nantong University, Nantong 226019, China;
4 State Key Laboratory of Transducer Technology, Shanghai 200050, China

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