Chin. Phys. B
中国物理B  2017, Vol. 26 Issue (5): 058502    DOI: 10.1088/1674-1056/26/5/058502
INTERDISCIPLINARY PHYSICS AND RELATED AREAS OF SCIENCE AND TECHNOLOGY 最新目录| 下期目录| 过刊浏览| 高级检索 |
Modeling and understanding of the thermal failure induced by high power microwave in CMOS inverter
Yu-Hang Zhang(张宇航), Chang-Chun Chai(柴常春), Yang Liu(刘阳), Yin-Tang Yang(杨银堂), Chun-Lei Shi(史春蕾), Qing-Yang Fan(樊庆扬), Yu-Qian Liu(刘彧千)
Key Laboratory of Ministry of Education for Wide Band-Gap Semiconductor Materials and Devices, School of Microelectronics, Xidian University, Xi'an 710071, China
Modeling and understanding of the thermal failure induced by high power microwave in CMOS inverter
Yu-Hang Zhang(张宇航), Chang-Chun Chai(柴常春), Yang Liu(刘阳), Yin-Tang Yang(杨银堂), Chun-Lei Shi(史春蕾), Qing-Yang Fan(樊庆扬), Yu-Qian Liu(刘彧千)
Key Laboratory of Ministry of Education for Wide Band-Gap Semiconductor Materials and Devices, School of Microelectronics, Xidian University, Xi'an 710071, China

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